NXP Extends ESD Protection Portfolio for High-Speed Interfaces
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NXP Extends ESD Protection Portfolio for High-Speed Interfaces

Hamburg : Germany | Sep 06, 2012 at 6:21 AM PDT
Source: PRWeb
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ESD (electrostatic discharge) protection, today announced its expanded range of circuit protection devices combining both ultra-low capacitance and ultra-low clamping voltages. Thunderbolt, USB 3.0/2.0 and Ethernet.

Highlights of the latest additions to NXP’s ESD protection portfolio include:

  •     Deep snapback combined with very low dynamic resistance. Highly sensitive to ESD pulses, the latest system-on-chips (SoCs) for ultra-high-speed data lines require system-level circuit protection up to 10 kV (IEC61000-4-2), as well as extra support for signal integrity. The NXP IP4294CZ10-TBR and IP4369CX4 are designed to protect even the most sensitive high-speed interfaces: They offer a unique blend of deep snapback (2.95 V typ @ 1A) and a very low dynamic resistance of only 0.4 Ohm and 0.2 Ohm, respectively. The IP4294 is already used for USB 3.0 applications by major players in the industry and offers the strongest overall SoC protection against ESD pulses. It is housed in a leadless DFN2510A-10 (SOT1176) package that is designed for pass-through routing which optimizes signal integrity and simplifies board layout. Wafer Level Chip Scale package) footprint.
  •     Low clamping / standard breakdown devices. NXP also provides low clamping parts without snapback for universal use, including applications connected to DC current sources with high current limits, such as Vbus...These devices offer best-in-class overshoot and clamping voltages (of 7.5 V after 30 ns for an 8 kV ESD pulse, in compliance with IEC61000-4-2) and ultra-low capacitance down to 0.49 pF (typ).
  •     Strongest protection in a tiny footprint...Other options include NXP’s innovative leadless solderable side pads package, which enables visual inspection and provides very robust soldering (DFN1006D-2). High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011...Copies of our SEC filings are available from on our Investor Relations website, nxp.com/investor or from the SEC website, sec.gov.

    For the original version on PRWeb visit: http://www.prweb.com/releases/prweb2012/9/prweb9874290.htm

 
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