Kaohsiung Manufacturing, Testing and Validation facility held on June 8th, 2012 in Taiwan. Flash module production level testing, ATP’s new facility features an elevated temperature burn in process which reduces field failures due to fringe manufacturing defects and IC infant mortality. This process allows for enhanced production level efficiency and scalability. The enhanced SMT capability ensures efficient prototyping, special design production and upside mass production support. Also, the enhanced joint/supplemental validation capability allows for larger dedicated lab resources to OEM partner host device testing with dedicated environmental testing equipment. Furthermore, enhancements in internal new product validation testing improve validation capabilities for mission critical applications in areas such as IC reliability in wide operating temperatures, power cycling and endurance.
“Our new Kaohsiung facility showcases ATP’s focus on not only manufacturing, but also module level value added services,” said Jeff Hsieh, ATP Senior Director of Business Development. “Although execution of business may not be perfect, the alignment with our customers for continuous improvement should be. Our customers are looking for improved validation coverage and production level quality...With over twenty years of experience in the design, manufacturing and support of memory products, ATP continues to focus on mission critical applications such as industrial, telecom, medical and enterprise computing where high levels of technical support, performance consistency and wide operating temperature ranges are required. As a true manufacturer, ATP offers in house design, testing and product tuning. ATP also offers extensive supply chain support with controlled/fixed BOM’s and long product life cycles. For more information on ATP products please visit http://www.atpinc.com or contact sales(at)atpinc(dot)com.
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