EDA Sign-off Analysis champion Invarian extends its portfolio with new offering in 3D with its 3D Frontier line, including Thermal and Mechanical Stress for chip/package analysis
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EDA Sign-off Analysis champion Invarian extends its portfolio with new offering in 3D with its 3D Frontier line, including Thermal and Mechanical Stress for chip/package analysis

Santa Clara : Cuba | May 29, 2012 at 9:20 AM PDT
Source: PR Newswire
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Invarian Inc., a leading provider of electronic design automation (EDA) software is now adding 3D thermal and 3D mechanical stress to its physical sign-off tools.  In addition to the InVar Pioneer suite of sign-off analysis tools, 3D Frontier will be on display at the Design Automation Conference... FULL ARTICLE AT PR Newswire
 
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